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Home ProductsMolybdenum ProductsMo 50% Cu 50% Molybdenum Copper Heat Sinks 0.1mm-5.0mm Thickness
Mo 50% Cu 50% Molybdenum Copper Heat Sinks 0.1mm-5.0mm Thickness
Mo 50% Cu 50% Molybdenum Copper Heat Sinks 0.1mm-5.0mm Thickness Mo 50% Cu 50% Molybdenum Copper Heat Sinks 0.1mm-5.0mm Thickness Mo 50% Cu 50% Molybdenum Copper Heat Sinks 0.1mm-5.0mm Thickness Mo 50% Cu 50% Molybdenum Copper Heat Sinks 0.1mm-5.0mm Thickness

Mo 50% Cu 50% Molybdenum Copper Heat Sinks 0.1mm-5.0mm Thickness

Product Details:
Place of Origin: China
Brand Name: JX
Certification: ISO
Model Number: Good Quality Molybdenum Copper Heat Sinks With Low Pirce
Payment & Shipping Terms:
Minimum Order Quantity: 10kgs
Price: according to actual products
Packaging Details: standard packing
Delivery Time: 25days
Payment Terms: T/T
Supply Ability: 300kgs month
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Detail Information
Size: As Request Quality: ISO9001:2008
Surface: Polishing,burnishing,black Surface Delivery Time: 25days
Packing: Standard Exporting Name: Good Quality Molybdenum Copper Heat Sinks With Low Pirce
Highlight:

Cu 50% Molybdenum Copper Heat Sinks

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Mo 50% Molybdenum Copper Heat Sinks

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5.0mm Molybdenum Copper Heat Sinks

Product Description

Good Quality Molybdenum Copper Heat Sinks With Low Pirce

Name:Molybdenum Copper Heat Sinks

  • Composition: Mo 50%, Cu 50%
  • Density: 9.4g/cm3
  • Coefficient of Thermal Expansion (10-6/K): 9.8
  • Thermal Conductivity (W/mK): 245
  • Specific Heat Capacity (J/kgK): 320
  • Length: 5mm-300mm
  • Width: 5mm-300mm
  • Thickness: 0.1mm-5.0mm

Molybdenum Copper Heat Sinks high performance composites are fabricated from carefully controlled porous Molybdenum that is vacuum infiltrated with molten copper. This results in a MoCu composite that has high conductivity and a matched low thermal expansion for heat sinks.

Molybdenum copper composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of molybdenum, molybdenum copper has properties similar to those of silicone carbide, aluminum oxide, and beryllium oxide. The thermal conductivity and low expansion also make molybdenum copper alloy an excellent choice even for extremely dense circuits.

It is a composite of molybdenum and copper. By controlling the content of molybdenum, we can design its coefficient of thermal expansion (CTE), matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Kovar, etc.

Molybdenum Copper Heat Sinks Advantages: High thermal conductivity, Excellent hermetic, Excellent size control, surface finish and flatness, Semi-finished or finished (Ni/Au plated) products available

Molybdenum Copper Heat Sinks Picture:
Mo 50% Cu 50% Molybdenum Copper Heat Sinks 0.1mm-5.0mm Thickness 0Mo 50% Cu 50% Molybdenum Copper Heat Sinks 0.1mm-5.0mm Thickness 1

Tag:

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