
PVD Titanium Alloy Sputtering Target
Product Details:
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Place of Origin: | China |
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Brand Name: | JINXING |
Certification: | ISO 9001 |
Model Number: | Copper Rotatable Sputtering Target |
Payment & Shipping Terms:
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Minimum Order Quantity: | 1kg |
Price: | 15~100USD/kg |
Packaging Details: | Plywood case |
Delivery Time: | 10~25 work days |
Payment Terms: | L/C, D/A, D/P, T/T, Western Union |
Supply Ability: | 100000kgs/M |
Detail Information |
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Material: | Copper | Process: | CIP, HIP Pressing |
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Size: | Customized | Application: | PVD Coating, |
Density: | 8.96g/cm3 | Shape: | Round , Plate , Tube ,Rotatable Sputtering Target |
Grain Size: | Fine Grain Size, Good Density | Purity: | 99.999%, 99.9999% |
Highlight: | Copper Rotatable Sputtering Target,Sputtering Target With Smooth Surface,Copper Sputtering Target High Density |
Product Description
6N ultra-high purity electrolytic copper is mainly used in the production of sputtering target, evaporation film and anode materials for integrated circuits.
Purity: 99.999% ~ 99.9999%
For precise control of impurity content, Ag content can be controlled below 0.1ppm and s content below 0.02ppm
The content of gas elements (C, O, N, H) is less than 1ppm
Main uses: 6N copper has some properties similar to gold, good conductivity, ductility, corrosion resistance and surface performance, and low softening temperature. As a new kind of material, high-purity copper is not only used in the preparation of high-purity analytical standard test materials, various connecting wires for electronic industry, bonding wires for electronic packaging, high-quality audio wires and integrated circuits, sputtering targets for liquid crystal display and ion coating, but also an indispensable and precious material in the atomic energy, rocket, missile, aviation, aerospace and metallurgical industries . As a new material, ultra pure copper has been paid more and more attention. In addition to the preparation of high-purity analytical standard test materials, various connecting wires for electronic industry, bonding wires for electronic packaging, high-quality audio wires and integrated circuits, sputtering targets and ion coating for liquid crystal display, high-quality audio circuits and other high-tech fields, high-purity copper is also used in atomic energy, rockets, missiles, aviation, space navigation and other fields Precious materials are indispensable in metallurgical industry. With the development of high and new technology and the need of strategic materials, high-purity metals have higher and higher requirements for purity. The preparation and application of high-purity and ultra-high-purity metals in modern materials science and engineering are new and growing fields.
Among the production methods of high-purity copper, electrolytic refining technology is the most mature, widely used and the most promising method in industry. The key technology of electrolytic refining to produce high purity copper is to highly purify the electrolyte. The raw material is the cathode copper obtained by the general electrolytic plant. The purity of copper is improved by RE Electrolysis
Copper Rotatable Sputtering Target 99.9999% , Copper Tu beSputtering Target 99.9999% are available in varying sizes
Sizes:
Plate sputtering targets:
Thickness: 0.04 to 1.40" (1.0 to 35mm).
Width up to 20"(50 to 500mm).
Length: 3.9" to 6.56 feet( 100-2000mm)
other sizes as requested.
Cylinder sputtering targets:
3.94 Dia. x 1.58"(100 Dia. x 40mm)
2.56 Dia. x 1.58" (65 Dia. x 40mm)
or 63*32mm other sizes as requested.
Rotatable sputtering targets:
2.76 OD x 0.28 WT x 39.4”L (70 OD x 7 WT x 1000mm L)
3.46 OD x 0.39 WT x 48.4”L (88 OD x 10 WT x 1230mm L)
other sizes as requested.
Advantage:
1. Purity: 99.99% ~ 99.9999%
2. High density, no defects inside, even grains and smooth surface
3. Unique melting and casting pollution control process
4. It can meet the needs of customized alloy
5. Unique homogenization control technology of added elements
6. Unified microstructure control
Product Name | Element | Purirty | Melting Point ℃ | Density (g/cc) | Available Shapes |
High Pure Sliver | Ag | 4N-5N | 961 | 10.49 | Wire, Sheet, Particle, Target |
High Pure Aluminum | Al | 4N-6N | 660 | 2.7 | Wire, Sheet, Particle, Target |
High Pure Gold | Au | 4N-5N | 1062 | 19.32 | Wire, Sheet, Particle, Target |
High Pure Bismuth | Bi | 5N-6N | 271.4 | 9.79 | Particle, Target |
High Pure Cadmium | Cd | 5N-7N | 321.1 | 8.65 | Particle, Target |
High Pure Cobalt | Co | 4N | 1495 | 8.9 | Particle, Target |
High Pure Chromium | Cr | 3N-4N | 1890 | 7.2 | Particle, Target |
High Pure Copper | Cu | 3N-6N | 1083 | 8.92 | Wire, Sheet, Particle, Target |
High Pure Ferro | Fe | 3N-4N | 1535 | 7.86 | Particle, Target |
High Pure Germanium | Ge | 5N-6N | 937 | 5.35 | Particle, Target |
High Pure Indium | In | 5N-6N | 157 | 7.3 | Particle, Target |
High Pure Magnesium | Mg | 4N | 651 | 1.74 | Wire, Particle, Target |
High Pure Magnesium | Mn | 3N | 1244 | 7.2 | Wire, Particle, Target |
High Pure Molybdenum | Mo | 4N | 2617 | 10.22 | Wire, Sheet, Particle, Target |
High Pure Niobium | Nb | 4N | 2468 | 8.55 | Wire, Target |
High Pure Nickel | Ni | 3N-5N | 1453 | 8.9 | Wire, Sheet, Particle, Target |
High Pure Lead | Pb | 4N-6N | 328 | 11.34 | Particle, Target |
High Pure Palladium | Pd | 3N-4N | 1555 | 12.02 | Wire, Sheet, Particle, Target |
High Pure Platinum | Pt | 3N-4N | 1774 | 21.5 | Wire, Sheet, Particle, Target |
High Pure Silicon | Si | 5N-7N | 1410 | 2.42 | Particle, Target |
High Pure Tin | Sn | 5N-6N | 232 | 7.75 | Wire, Particle, Target |
High Pure Tantalum | Ta | 4N | 2996 | 16.6 | Wire, Sheet, Particle, Target |
High Pure Tellurium | Te | 4N-6N | 425 | 6.25 | Particle, Target |
High Pure Titanium | Ti | 4N-5N | 1675 | 4.5 | Wire, Particle, Target |
High Pure Tungsten | W | 3N5-4N | 3410 | 19.3 | Wire, Sheet, Particle, Target |
High Pure Zinc | Zn | 4N-6N | 419 | 7.14 | Wire, Sheet, Particle, Target |
High Pure Zirconium | Zr | 4N | 1477 | 6.4 | Wire, Sheet, Particle, Target |
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