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Home ProductsSputtering TargetsTitanium Plate Sputtering Targets High Purity For Semiconductor Chips
Titanium Plate Sputtering Targets High Purity For Semiconductor Chips
Titanium Plate Sputtering Targets High Purity For Semiconductor Chips
Titanium Plate Sputtering Targets High Purity For Semiconductor Chips Titanium Plate Sputtering Targets High Purity For Semiconductor Chips Titanium Plate Sputtering Targets High Purity For Semiconductor Chips

Titanium Plate Sputtering Targets High Purity For Semiconductor Chips

Product Details:
Place of Origin: China
Brand Name: JINXING
Certification: ISO 9001
Model Number: Titanium Sputtering Target
Payment & Shipping Terms:
Minimum Order Quantity: 1kg
Price: 20～200USD/kg
Packaging Details: Plywood case
Delivery Time: 10～25 work days
Payment Terms: L/C, D/A, D/P, T/T, Western Union
Supply Ability: 100000kgs/M
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Detail Information
Material: Titanium Plate Sputtering Target Process: CIP, HIP Pressing
Size: Customized Application: PVD Coating System
Shape: Round , Plate, Tube Grain Size: Fine Grain Size, Good Density
Purity:: 99.95%, 99.99%, 99.999% Density: 4.52g/cm3
Highlight:

Titanium Plate Sputtering Targets

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Sputtering Target For Semiconductor Chips

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Customized CIP Sputtering Target

Product Description

Titanium Plate Sputtering Target high purity 99.99%, 99.999%

High purity material, ultra-high purity material, semiconductor high purity material

 

Products include low oxygen ultra-high purity titanium material, high-end titanium alloy material, production equipment and process development of low oxygen ultra-fine (spherical) Ti powder and Ti alloy powder, advanced metal pressure processing technology, process development of low-cost Ti, near net forming processing technology (additive manufacturing, precision casting). It is widely used in the purification and preparation of ultra-high purity metal materials for semiconductors, the preparation and processing of high-end titanium alloys for aviation, offshore oil, green energy, medical devices and other fields.

 

Titanium is widely used in various fields of modern industry because of its superior comprehensive properties. However, titanium with ordinary purity is far from meeting the most advanced technical requirements in the core strategic fields such as semiconductor integrated circuit, aerospace, military industry, medical treatment, petrochemical industry, etc. From 99.98% to 99.999%, although there is only a little bit in the number, it has made a qualitative leap. Only ultra-high pure titanium can meet the raw material requirements of many modern industries and advanced processing technologies, such as sputtering target materials for semiconductor chips, high-end titanium alloy for aerospace, high-end titanium powder for 3D printing, etc

 

 

Titanium Plate Sputtering Target 99.99% ,  Titanium Plate Sputtering Target 99.999% are available in varying sizes 

 

 

Product Name Element Purirty Melting Point ℃ Density (g/cc) Available Shapes
High Pure Sliver Ag 4N-5N 961 10.49 Wire, Sheet, Particle, Target
High Pure Aluminum Al 4N-6N 660 2.7 Wire, Sheet, Particle, Target
High Pure Gold Au 4N-5N 1062 19.32 Wire, Sheet, Particle, Target
High Pure Bismuth Bi 5N-6N 271.4 9.79 Particle, Target
High Pure Cadmium Cd 5N-7N 321.1 8.65 Particle, Target
High Pure Cobalt Co 4N 1495 8.9 Particle, Target
High Pure Chromium Cr 3N-4N 1890 7.2 Particle, Target
High Pure Copper Cu 3N-6N 1083 8.92 Wire, Sheet, Particle, Target
High Pure Ferro Fe 3N-4N 1535 7.86 Particle, Target
High Pure Germanium Ge 5N-6N 937 5.35 Particle, Target
High Pure Indium In 5N-6N 157 7.3 Particle, Target
High Pure Magnesium Mg 4N 651 1.74 Wire, Particle, Target
High Pure Magnesium Mn 3N 1244 7.2 Wire, Particle, Target
High Pure Molybdenum Mo 4N 2617 10.22 Wire, Sheet, Particle, Target
High Pure Niobium Nb 4N 2468 8.55 Wire, Target
High Pure Nickel Ni 3N-5N 1453 8.9 Wire, Sheet, Particle, Target
High Pure Lead Pb 4N-6N 328 11.34 Particle, Target
High Pure Palladium Pd 3N-4N 1555 12.02 Wire, Sheet, Particle, Target
High Pure Platinum Pt 3N-4N 1774 21.5 Wire, Sheet, Particle, Target
High Pure Silicon Si 5N-7N 1410 2.42 Particle, Target
High Pure Tin Sn 5N-6N 232 7.75 Wire, Particle, Target
High Pure Tantalum Ta 4N 2996 16.6 Wire, Sheet, Particle, Target
High Pure Tellurium Te 4N-6N 425 6.25 Particle, Target
High Pure Titanium Ti 4N-5N 1675 4.5 Wire, Particle, Target
High Pure Tungsten W 3N5-4N 3410 19.3 Wire, Sheet, Particle, Target
High Pure Zinc Zn 4N-6N 419 7.14 Wire, Sheet, Particle, Target
High Pure Zirconium Zr 4N 1477 6.4 Wire, Sheet, Particle, Target

 


Application field of sputtering coating: Sputtering coating is widely used in packaging coating, decoration coating, architectural glass coating, automobile glass coating, low radiation glass coating, flat panel display, optical communication / optical industry, optical data storage industry, optical data storage industry, magnetic data storage industry, optical coating, semiconductor field, automation, solar energy, medical treatment, self lubrication film, capacitor Device coating, other functional coating, etc. (click to enter the detailed introduction)


Sputtering target backplane supply, bonding service: the center provides a variety of sputtering target backplane, including oxygen-free copper, molybdenum, aluminum, stainless steel and other materials. At the same time, it provides the welding service between the target and the back plate.

Titanium Plate Sputtering Targets High Purity For Semiconductor Chips 0

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tungsten sputtering target

metal sputtering targets

titanium sputter target

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